Tic™ 900 is a high performance, non-electrically conductive phase change material. At 50°C, Tic™ 900 begins to soften and flow, filling the microscopic irregularities of both the thermal solution and the component´s surfaces, thereby reducing thermal resistance.
Tic™ 900 is a flexible solid at room temperature and freestanding without reinforcing components that reduce thermal performance.
Tic™ 900 si hows no thermal performance degradation after 1,000 hours @130°C, or after 500 cycles, from -25°C to 125°C. The material softens and does not fully change state resulting in minimal migration (pump out) at operating temperatures (see viscosity curve).
Tic™ 900 is supplied in rolls with top tabbed liners for easy manual or large volume automatic application. Individually die cut parts can alsobe supplied.


Features and Benefits:
• 0.03 ºC-in2/watt thermal resistance
• Naturally tacky at room temperature,no adhesive required • No heatsink preheating required
• Available in 3 thicknesses, 0.005", 0.010" and 0.020" (0.125mm, 0.25mm and 0.50mm)

Applications:
• High frequency microprocessors
• Notebook and desktop PCs
• Computer servers
• DC/DC converts
• Memory modules
• Cache chips
• IGBTs



Standard Thicknesses: 0.005" (0.13mm) 0.010" (0.25mm) 0.020" (0.51mm)
Consult the factory for alternate thicknesses
Standard Sheet Sizes: 19" x 19" (480mm x 480mm)
Tic™ 900 sheets are supplied with a white release paper and a bottom liner. Tic™ 900 is available in rolls with an extended tab liner or individual die cut shapes. Pressure Sensitive Adhesive: Pressure sensitive adhesive is not applicable for Tic™ 900™ products.
Reinforcement: No reinforcement is necessary.