Hot Manage Solve-Shenzhen Laices New Materials CO.,Ltd

laices@126.com

0755-89704985

0755-89704982

Products

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Products

Hot Manage Solve
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Thermal filling material

Thermal silica cloth

Thermal change material

Thermal paste
Die Products
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Insulation Materials

Foam

Double adhesive
Shielding materials
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Conductive cloth

Conductive aluminum foil

Conductive foam

Conductive copper foil

Conductive Rubber

Absorbing Materials
Hardware
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Thermal Module

Hardware stamping

Hardware terminal

G802

G-Filler 802Series Thermal Interface material -Gap Filler Pad General Usage: Highly Compressible Thermal Gap Filler with 3.0 W/m-K

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