High Performance Insulator for Low-Pressure Applications
Features and Benefits
• Thermal impedance:0.45°C-in2/W (@100 psi)
• Electrically isolating
• Low mounting pressures
• Smooth and highly compliant surface
• General-purpose thermal interface material solution

The true workhorse of the LEX-Pad product family, LEX-Pad 9000S thermally conductive insulation material, is designed for a wide variety of applications requiring high thermal performance and electrical isolation.These applications also typically have low mounting pressures for component clamping.
LEX-Pad 9000S material combines a smooth and highly compliant surface characteristic with high thermal conductivity.These features optimize the thermal resistance properties at low pressures.

Applications requiring low component clamping forces include discrete semiconductors (TO-220,TO-247 and TO-218) mounted with spring clips. Spring clips assist with quick assembly and apply a limited amount of force to the semiconductor.The smooth surface texture of LEX-Pad9000S minimizes interfacial thermal resistance and maximizes thermal performance.

TYPICAL PROPERTIES OF LEX-PAD 9000S

PROPERTY	IMPERIAL VALUE	METRIC VALUE	TEST METHOD
Color	Pink	Pink	Pink
Reinforcement Carrier	Fiberglass	Fiberglass	--
Thickness (inch) / (mm)	0.009	0.229	ASTM D374
Hardness (Shore A)	90	90	ASTM D2240
Elongation (%45° to Warp and Fill)	20	20	ASTM D412
Tensile Strength (psi) / (MPa)	1300	9	ASTM D412
Continuous Use Temp (°F) / (°C)	-76 to 356	-60 to 180	--
ELECTRICAL
Dielectric Breakdown Voltage (Vac)	6000	6000	ASTM D149
Type 3 Electrodes	8300	8300	ASTM D149
Dielectric Constant (1000 Hz)	6.0	6.0	ASTM D150
Volume Resistivity (Ohm-meter)	1.1*1010	1.1*1010	ASTM D257
Flame Rating	V-O	V-O	U.L. 94
THERMAL
Thermal Conductivity (W/m-K)	1.6	1.6	ASTM D5470
THERMAL PERFORMANCE vs PRESSURE
Pressure (psi)	10 25	50 100	200
TO-220 Thermal Performance (°C/W)	3.96      3.41	2.90      2.53	2.32
Thermal Impedance (°C-in2/W) (1)	0.98      0.78	0.61      0.45	0.41

1) The ASTM D5470 test fixture was used.The recorded value includes interfacial thermal resistance.These values are provided for
reference only. Actual application performance is directly related to the surface roughness, flatness and pressure applied.

Typical Applications Include:
• Power supplies
• Automotive electronics
• Motor controls
• Power semiconductors
Configurations Available:
• Sheet form, die-cut parts and roll form
• With or without pressure sensitive adhesive

Building a Part Number


Standard Options
NA = Selected standard option. If not selecting a
texture of LEX-Pad9000S minimizes interfacial
thermal resistance and maximizes thermal
performance.
standard
option, insert company name, drawing number, and
revision level.
_ _ _ = Standard configuration dash number,
1212 = 12" x 12" sheets, 12/250 = 12" x 250´ rolls,
00 = custom configurationor
AC = Adhesive, one side
00 = No adhesive
Standard thicknesses available: 0.009"
SP9000s= LEX-Pad 9000S Material