This product is of high purity, small particle size distribution, surface area, low high surface activity, bulk density, good injection molding properties; for composite materials, and semiconductor silicon matching, interface compatibility, and can be improve the mechanical properties and thermal insulation properties of the composites.

◆ The main parameters of this product uses a plasma arc vapor-phase synthesis method of production, color is white, with an average size of less than 50 nm, nanometer AlN powder thermal conductivity of up to 320W / (mk), and copper is almost, but also a high degree of insulation, electrical resistivity at 10 15 th or more, and can withstand 1400 degree heat.